Abstract
Bulk chemical etching of single-crystal semiconducting silicon in aqueous alkaline solutions of KOH was studied at various solution temperatures, alkaline component concentrations, and microscopic amounts of a potassium ferricyanide additive. Specific effects of these factors on the process of silicon etching are explained by comparing the corresponding activation energies. The possibility of using alkaline aqueous solutions of KOH with a potassium ferricyanide additive for fabrication of elements in microsystem technology devices is assessed.
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