Abstract

The specific features in the generation and motion of dislocations are investigated in Si: N single crystals grown by the Czochralski method. The motion of dislocation loops is analyzed by the four-point bending technique in the temperature range 500–800°C. The dislocation loops are preliminarily introduced into the samples with the use of a Knoopp indenter at room temperature. It is found that doping with nitrogen leads to a considerable increase in the critical stress of the onset of dislocation motion from surface sources (indentations) and in the stress of the generation of dislocations from internal sources. The velocity of dislocation motion in Si: N crystals is less than that in undoped crystals (under comparable loads). The hardening effect of nitrogen is explained by the fact that nitrogen promotes the decomposition of a solid solution of oxygen in silicon during postcrystallization cooling.

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