Abstract
This paper aims at developing a stochastic-elastic model of a soft elastic body adhering on a wavy surface via a patch of molecular bonds. The elastic deformation of the system is modeled by using continuum contact mechanics, while the stochastic behavior of adhesive bonds is modeled by using Bell's type of exponential bond association/dissociation rates. It is found that for sufficiently small adhesion patch size or stress concentration index, the adhesion strength is insensitive to the wavelength but decreases with the amplitude of surface undulation, and that for large adhesion patch size or stress concentration index, there exist optimal values of the surface wavelength and amplitude for maximum adhesion strength.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
