Special Issue on Hot Chips 33

Abstract

The articles in this special section are focus on new chip technologies presented at the Hot Chips 33 Conference held in August 2021. The Hot Chips Conference has served as a leading venue for presenting the technical details of innovative chips designed by academics, startup companies, and established leaders in the field. The conference in 2021 included presentations on a wide range of chips and upcoming chip and packaging technologies. The program committee carefully selected several presentations for which we invited the authors to write an article. Following the customary review process, four articles were accepted to be included in this special issue. These articles describe central processing units (CPUs) that are used in a broad range of products from servers and desktops to mobile solutions, a chip for accelerating AI recommendations, and an HBM2 chip that includes in-memory processing capability. As process technologies continue to provide more transistors per die, each of these chips shows the continuing trend of using those transistors to deliver more functionality per part.