Special Issue on Cool Chips and Hot Interconnects

Abstract

This special issue brings to IEEE Micro’s readership the best from two interesting conferences - Cool Chips 2021 and Hot Interconnects 2021. Cool Chips is a conference that focuses on the research on state-of-the-art low-power, high-speed chips and challenges facing researchers to simultaneously achieve low power consumption and high chip performance. The past couple of years have seen a flurry of research in low-power high-speed chips in artificial intelligence (AI), Internet of Things (IoT), consumer electronics, etc., and several of these were presented at the Cool Chips conference. Three selected papers from Cool Chips are presented in this issue. This special issue also presents a collection of articles on interconnect technologies based on the Hot Interconnect Conference of August 2021. Hot Interconnects is a conference that brings to light state of the art in interconnect technology. In modern systems on chip and large-scale computer systems, many processing components are being interconnected and the larger system’s performance and energy consumption significantly depends on the interconnect. Five selected articles from Hot Interconnects are presented in this issue. These are briefly summarized here.