Spatial micro-processing of mono-crystallin silicon with hybrid chemical-laser etching method in KOH with the use of fiber laser

Abstract

The authors proposed hybrid technology of chemical and laser spatial processing (HCL Hybrid Chemical Laser) for spatial micro-machining of monocrystalline silicon. It rests on conducting the process of etching liquid with simultaneous use of laser beam on the areas being etched. The laser beam changes the temperature field of material and liquid, locally activates the surface of the material decreasing the activating energy of its etching and increases activity of etching liquid. It enables manufacture of structures of high quality together with significantly higher velocity of etching, when there is no need to use intermediate critical processes connected, for example, with masking.The article presents the results of hybrid chemical and laser etching (HCL) of silicon in solution of KOH with the use of fiber laser (wavelength of 1070 nm) working both in continuous and pulsed modes. Influence of laser beam and etching liquid parameters on created structures has been examined. Subsequently, the results have been compared with the structures created with the use of direct classic laser machining as well as chemical processing.The authors proposed hybrid technology of chemical and laser spatial processing (HCL Hybrid Chemical Laser) for spatial micro-machining of monocrystalline silicon. It rests on conducting the process of etching liquid with simultaneous use of laser beam on the areas being etched. The laser beam changes the temperature field of material and liquid, locally activates the surface of the material decreasing the activating energy of its etching and increases activity of etching liquid. It enables manufacture of structures of high quality together with significantly higher velocity of etching, when there is no need to use intermediate critical processes connected, for example, with masking.The article presents the results of hybrid chemical and laser etching (HCL) of silicon in solution of KOH with the use of fiber laser (wavelength of 1070 nm) working both in continuous and pulsed modes. Influence of laser beam and etching liquid parameters on created structures has been examined. Subsequently, the results have...