Spark Plazma Sinterlenmiş Cu-SiC Kompozitlerinin Fiziko-Mekanik ve Elektriksel Özelliklerinin Değerlendirilmesi

Abstract

In this study, SiC reinforced Cu matrix composites were produced by spark plasma sintering to provide rapid consolidation and to prevent weak interfacial bonding and grain growth, undesired phases at the interphase region. In addition, the influence of the reinforcement ratio (vol.% 10, 20, 30) and particle sizes (1, 11, 24 µm) on the physico-mechanical (density, hardness) and electrical characteristics of copper composite materials was aimed. The bulk density values were determined by Archimedes’ method, SEM, EDS, and XRD analysis were used to identify microstructural factors and phase analysis. It was found that the selection of the appropriate sintering regime is very important for composite samples to reach nearly fully dense Cu-SiC composites with proper interfacial bonding between Cu and SiC grains without the formation of any undesired phases, results in very high relative density (min. 99.48%), low total porosity (0,15-0,52), good hardness (HV 122-186) and electrical conductivity. When fine SiC grains (~1 micron) are used and the amount of SiC increases, the hardness value of the composites was effectively improved without much loss in electrical conductivity. In this respect, this study provides an effective solution for the production of Cu-SiC composites with excellent combined performance.