Something for Nothing – Developing MEMS Silicon for a Vertically Integrated Market Leading Business – The example of HP Thermal Inkjet

Abstract

There are two essential steps in growing and sustaining vertically-integrated market leading technologies in a field as diverse as digital printing, and these steps can be summarized as creation and refreshment of technology platforms. Growth is enabled by the creation of new platforms that bring new capabilities to open new application opportunities. Because maturing markets present price and performance challenges to each new generation, sustaining market presence over time can be achieved by refreshing existing platforms - offering “Something for Nothing” by extending the current platforms. 'Improved performance at the same cost', or 'the same performance at reduced cost' can be strong value propositions to extend existing platforms. Traditionally in integrated circuit businesses, this is done by reducing electronics cost or increasing performance according to Moore's Law. MEMS (Micro Electro-Mechanical System) processes take considerably longer to develop than conventional IC processes resulting in a more difficult challenge to keep up with the fast pace of product introductions. This is partially-compensated by the much longer lifetime a successful MEMS process can enjoy, so it becomes essential to create improved MEMS designs and process variants that add features and/or reduce cost. HP's Scalable Printing Technology (SPT) is used in HP's vertically-integrated inkjet printer and web press product lines that span a price range from $99 to $4.5M and are produced by many HP divisions. Innovations within SPT that enable new silicon value propositions will be used to demonstrate the strategic benefits of giving internal product developers and HP customers 'Something for Nothing'. Examples include silicon circuit and process simplifications to enable cost reductions, fluidic process and design optimizations to enhance performance, and radical design and process technology improvements within the existing footprint of silicon printhead chips (called “die”) to add completely new capabilities.