Abstract

Some general aspects of pulse plating are treated, in particular mass transport and capacitance effects. A simple model which allows the visualization of the phenomena involved and which facilitates their estimation is used to describe the mass transport. The paper also deals with the factors which limit the useful range of conditions in pulse plating, i.e. the pulse generator, capacitance effects and mass transport effects. Mass transport effects are limiting in two ways: (a) depletion near the cathode actually limits the rate of metal deposition; (b) the depletion also causes powder formation. The current density distribution in pulse plating is discussed briefly in relation to the latter phenomenon.

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