Abstract
The plated gold being used by the electronics industry can be broadly classified into two categories: soft gold and hard gold. Soft gold is used for circuit metallization and for bonding semiconductor chips, while hard gold is indispensable as the contact material on electrical connectors, electromechanical relays, and printed circuit boards. The traditional baths from which to plate soft gold as well as hard gold contain the cyanide complex, [Au(CN)2]-, as the source of gold, which liberates free cyanide ions during the plating. The free cyanide is not only highly toxic but also attacks photoresists used to delineate circuit patterns and bonding pads. For these reasons, noncyanide baths are in use to plate soft gold, whereas hard gold can be plated only from cyanide baths at present. In this presentation, the current status of both electrolytic and electroless non-cyanide processes for plating soft gold will be reviewed.
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