Some new packaging schemes for integrated circuits

Abstract

This paper investigates interconnection schemes based on multilayer printed wiring techniques necessitated by the development and the subsequent introduction of integrated circuits into the systems technology. The integrated circuits used in the particular scheme discussed and illustrated in this paper are current mode fast digital circuits packaged in the familiar TO-5, 10-pin device package. But similar designs exist for other device packages such as the ceramic flat package. The design of the interconnection scheme evolves around a predesigned TO-5, 10-pin package matrix with sandwiched voltage planes (one layer per voltage) and with all the logic signal interconnection lines on the two outside sides of the multilayer printed circuit board.