Abstract
A flexible cantilever method has been used to measure stress in films of tantalum, tungsten, molybdenum, chromium, nickel, copper and gold deposited by low pressure sputtering in argon. In all cases the stress was compressive. With tantalum, tungsten and molybdenum stress values of over 100 kgf/mm2 were found under some conditions. A detailed study of the stress in tantalum films indicates the importance of the part played by residual gases. Tantalum oxide films formed by reactive sputtering have been found to have a low tensile stress.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
