Some hybrid technologies comparison in the manufacturing of multi-chip modules for space application

Abstract

A multichip-module (MCM) hybrid has been manufactured by several technological approaches for space applications. Results of investigations into some technology alternatives to thick-film multilayer technology are presented. In particular, thin-film multilayer technologies using polyimides or SiO/sub 2/ as dielectric have been evaluated, multilayer thin-film technology and low-temperature cofired ceramic multilayer technology allow higher interconnection density and high-speed applications. It has been demonstrated, by an MCM reference hybrid, that modules manufactured by these technologies have at least the same performance as the thick-film version, and allow savings of room and mass. >