Abstract
This paper reviews some continuing IBM study efforts conducted on surface mounted Leadless Chip Carrier (LCC) packaging for use in high density, high thermal stress military environments. The paper presents some designs, materials and solder joint processing considerations that can affect solder joint fatigue life. Also discussed are some thermal cycling test limitations, important properties of solder failure mechanisms and finally some technical concerns with both WS 6536E and DoD 2000 specifications as to their limitations with future surface mounted technologies.
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