Abstract
Abstract The paper deals with some characteristics of electrospark deposition. A relevant device and the process are described, the material transfer is shown schematically, and the average droplet mass, the thickness of deposited layer, and the layer roughness are determined. Two types of substrate (tool steel, austenitic stainless steel), two types of shielding gas, (Ar, He), and three types of filler material, (WC, TiC, Stellite 6) were used. With some deposits, chemical analyses of deposit surfaces were performed and with some others through-thickness chemical analyses. Among the final conclusions the most important one is that the addition of a shielding gas results in a considerable increase in deposit quality. The device manufacturer, however, recommends deposition without the addition of a shielding gas.
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