Abstract
The anodic behavior of zinc has been studied in sulfamic acid‐formamide solutions as a function of sulfamic acid concentration, temperature, and water content of solutions. It has been shown that anodic polarization curves for Zn are typical of polishing systems, and it has been found that linear relationships exist between limiting current densities and the reciprocal viscosities of the solutions. The processes in solution are controlled by diffusion of cations or of solvent species. Film formation occurs at the onset of polishing as shown by a‐c impedance studies, and this film is either highly soluble or unstable in the presence of considerable amounts of water. The over‐all conclusion is that the mechanisms of polishing in sulfamic acid‐formamide solutions are in agreement with those proposed by Hoar for anodic polishing in other environments.
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