Abstract
In recent years, many assembly houses have been actively seeking cost reduction techniques. Due to the contribution of consumables to the total cost of the wire bonding process, focus has turned to capillary life-span as a major factor in the qualification process. To answer the assembly industry's need for cost reductions, K&S Bonding Tools has designed a specialized extended-life capillary. This article discusses methods and techniques used during the study and development of this extended-life design. Techniques and measurement tools such as Build-up Measurements, Finite Element Analysis (FEA), Process Power Sensitivity Testing (PST), and Tool Life Simulations, were assessed in order to find a suitable capillary design that provides a strong, robust, and more durable wire bonding life performance.
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