Solution-Phase Synthesis of Superhydrophobic Copper Surface with Dual Scale Roughness

Abstract

A copper sulfide film with dual scale micro-and nano-structured roughness was constructed on copper foil via a facile solution-phase method using the sodium thiosulphate and cupric chloride as raw materials.The resulting film was characterized by X-ray diffraction(XRD),scanning electron microscopy (SEM),energy dispersive X-ray(EDX)spectrometer,and contact angle measurements.After stearic acid hydrophobization,the film exhibited a water contact angle of 161°and a sliding angle of 2.5°for a 5μL water droplet.The superhydrophobicity was attributed to a combination of the dual scale roughness at the micro-and nano-meter levels and the low surface energy of the stearic acid coating.This is a simple synthetic methodology requiring no complex or harsh equipment.The copper surface obtained has the excellent non-sticking property,long-term storage stability,and relatively good anti-abrasion property.