Abstract

The solute redistribution during initial transient process of directional solidification of a binary alloy is associated with the solid-liquid interface advancing velocity which will pass a hysteretic process approaching to the externally imposed velocity. In the present paper, a new accelerated growth equation, dV/dt = μG[m/G · dG*L/dt + Ve - V] is deduced, based on which a new formula for the initial transient solute redistribution is obtained with the reasonable assumption that the solid-liquid interface advancing velocity changes exponentially during solidification. It shows that the kinematic effect dominates solidification at high velocity while the coupling effect of thermal and mass transportation controls that at lower velocity. In addition, another new equation to calculate the time required for a planar interface to lose stability is also found. Since the effects of the imposed thermal gradient are taken into account in the new equations, they are more reasonable and satisfactory than those given by Tiller et al. and by Smith et al.

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