Abstract
In this study, we investigated the microstructure of (TiVCrZrHf)N multi-element coating deposited on Si(100) substrate by magnetron sputtering system. Interestingly, the film showed an unusual structure evolution. A continuous and amorphous initial (TiVCrZrHf)N layer formed on the substrate. As film thickness increased, randomly oriented small (TiVCrZrHf)N grains formed, followed by the development of columnar grains with FCC crystal phase. In contrast to previous studies, the nitride coatings grew on substrates with a 270-nm amorphous interlayer. Under appropriate parameters, the occurrence of the unusual microstructure could be attributed to the sluggish diffusion of the multi-principal components. The maximum hardness of 33.5GPa was obtained when coating was deposited under substrate bias of −100V and at substrate temperatures of 723K.
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