Solid-phase crystallization of amorphous Si films on glass and Si wafer

Abstract

When amorphous silicon films deposited on glass by physical or chemical vapor deposition are annealed, they undergo crystallization by nucleation and growth. The growth rate of Si crystallites is the highest in their 〈111〉 directions along or nearly along the film surface. The directed crystallization is likely to develop the 〈110〉//ND or 〈111〉//ND oriented Si crystallites. As the annealing temperature increases, the equiaxed crystallization increases, which in turn increases the random orientation. When amorphous Si is under a stress of the order of 0.1 GPa at about 540 °C, the tensile stress increases the growth rate of Si grains, whereas the compressive stress decreases the growth rate. However, the crystal growth rate increases with the increasing hydrostatic pressure, when the pressure is of the order of GPa at 530–540 °C. These phenomena have been discussed based on the directed crystallization model advanced before, which has been further elaborated.