Abstract
Hermetic seals are an essential part of microelectronics, namely, micro-electromechanical systems (MEMS) displays using organic-light emitting diodes (OLEDs) and electrochemical devices, such as microbatteries. Hermetic seals have to prevent humidity and other gases from reaching devices and degrading their performance. Typically, the barriers are applied once the devices have been assembled, and, consequently, the sealing material has to be hermetic at low processing temperatures. Hybrid organic–inorganic materials are capable of being applied in a sol–gel process at low temperature. A survey of sol–gel hybrid materials that are finding use in microelectronics is presented.
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