Solders development and application process for a micro chip-camera

Abstract

Nowadays, micro components have to fulfill rising optical requirements for different scientific and industrial fields like astronomy, medicine or multimedia. For this purpose, advanced miniaturized chip-cameras are produced for the microsystems engineering market. The assembly and joining technologies play a very important role in the production of these micro components. Several challenges are associated with the joining of chip-cameras. In this study, the application of the soldering technology has been considered in order to face these challenges. Two joining technologies have been investigated: active soldering and transient liquid phase (TLP) bonding. Both soldering processes have shown a big potential for hybrid microsystems joining in previous studies. For both processes, soldering alloys and parameters have been conceived in order to fulfill the joining requirements of the micro camera components. For instance, the joining temperature represents a major challenge because the chip-camera consists of a plastic material, polymethyl methacrylate (PMMA). Therefore, particular attention has been directed to the soldering as well as to the coating temperature. The experimental investigations concerning the solders application through physical vapor deposition (PVD) have been supported by finite element method (FEM) simulations. The analysis of the temperature distribution in the micro components during the coating process was the focus of the calculations. Possible undesirable local overheated areas of the chip-camera components can be detected through simulation.