Abstract
Suspended bridges of individual multiwalled carbon nanotubes were fabricated inside a scanning electron microscope by soldering the nanotube onto microelectrodes with highly conducting gold−carbon material. By the decomposition of organometallic vapor with the electron beam, metal-containing solder bonds were formed at the intersection of the nanotube and the electrodes. Current−voltage curves indicated metallic conduction of the nanotubes, with resistances in the range of 9−29 kΩ. Bridges made entirely of the soldering material exhibited resistances on the order of 100 Ω, and the solder bonds were consistently found to be mechanically stronger than the carbon nanotubes.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
