Abstract
A feasibility study has been conducted to determine whether the low temperature joining process such as soldering process and wire bonding process can be applied to join a bulk metallic glass (BMG) to a BMG and a BMG to a crystalline metal. Therefore, in order to evaluate the solderability of BMGs, the spread test of the solder was basically performed for three kind of BMGs in this study. As a result, Pd-based BMG exhibited a good wetting behavior of the solder at 503 K and 523 K. On the other hand, concerning Cu-based and Zr-based BMGs, there was no wetting of the solder on the surface of BMGs regardless of the peak temperature. Then the ultrasonic soldering process was tested to establish the joint process for BMGs. It was clear that the application of ultrasonic is effective to the soldering process.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
