Abstract
Solder preforms are generally made from solder alloy wire or stamped from solder alloy sheet material, produced in large quantities with tight tolerance. It's almost no limitation in shapes, sizes and alloy-composition. In this work, different solder preforms in shape and volume were used to supplement additional solder volume in several different component packages. The fill rate, void and formation of intermetallic compounds (IMC) were investigated by optical microscope, X-ray and cross section. It was found that solder preform is good option to provide extra solder material with low cost and high quality on miniaturization and complication PCBa assembly.
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