Abstract
Through-hole technology (THT) for the electronic circuits assembly is known for decades and recently is replaced by surface-mount technology (SMT). However, THT method is still widely used in many modern devices, where proper power dissipation is essential. The design for manufacturing (DFM) rules is important for the high reliability of the THT products. The experiment was performed for the various solder lands and hole sizes and two solder materials (lead-free solder Sn3Ag0.5Cu and Sn37Pb) on the printed circuit board (PCB) with the hot air solder leveling finish (HASL), specially designed for this purpose. The various types of THT electronic components were connected in the wave soldering process. Next, the PCB were subjected to the thermal cycles test (550 cycles from −20 °C to +80 °C) to verify the reliability of the solder joints under the extreme working conditions. The scanning electron microscopy (SEM) technique combined with an energy dispersive X-ray spectroscopy (EDS) allowed revealing the microstructure and chemical composition details of the obtained interconnections before and after the thermal tests.
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