Solder Joint Reliability Performance of Flip Chip Molded Ball Grid Array (BGA) Package for Network/Communication Application

Abstract

Flip chip molded package solder joint reliability (SJR) performance was evaluated by using mechanical shock and temperature cycling test. Package design factors that influence the SIR performance are considered. Temperature cycling results show that SIR performance decrease with thicker board and solder mask defined pad design. Most of the solder joint failures happen at the die shadow region with solder joint interface crack at package or board interface. As for mechanical shock test, a diagonal bend setup was used to generate the desired dynamic response. Typical failures in shock happen at package corner with solder joint package interface crack and board pad crater. The key finding in shock is the flip chip molded package shock capability is similar to flip chip ball grid array (FCBGA) package regardless of the package size and type.