Abstract
In this work a concept for detection of defects in the solder layer between a power semiconductor and the printed circuit board is proposed. Temperature sensors in form of discrete diodes are placed adjacent to the semiconductor. Three different test arrangements are investigated of which two possess a predefined fault within the solder layer. To experimentally validate the concept, the tested device is subjected to a power dissipation pulse and the temperature response at the sensors is recorded and evaluated. Conclusions about the existence and position of solder defects are drawn from the measured data. The sensitivity and usability of this concept is discussed. Furthermore, a 3D thermal simulation is provided to explain the measurement.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
