Abstract
Establishes a quantitative evaluation method on solder bridging in microsoldering using a printed wiring board with comb pattern conductors. Bridge tests were conducted by immersing the comb pattern board into a molten solder bath. The total length of solder bridge between conductors against the total length between conductors was measured as a measure of the occurrence of solder bridging. The occurrence of bridging depended on the number of immersions, flux activity including solid content, conductor spacing, solder bath temperature and solder composition. The increase in number of immersion enhanced bridging. The rosin flux without activators showed higher bridging than the activated flux. Sn‐37Pb solder showed lower bridging than Sn‐3.5Ag‐5Bi solder. Solder bridging was found to be closely correlated with wettability, therefore, the improvement of wettability could be effective to suppress solder bridging. The proposed method is believed to be suitable for the quantitative evaluation of solder bridging.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
