Abstract
The reliability of electronic assemblies depends on the reliability of their individual elements—e.g., integrated circuit (ICs); active components: chip carriers (CCs), small-outline integrated circuits (SOICs), small-outline transistors (SOTs), dual in-line packages (DIPs), small-outline J-leaded devices (SOJs), etc.); passive components (chip resistors, chip capacitors); printed wiring boards (PWBs); connectors; etc.—and the reliability of the mechanical, thermal, and electrical interfaces (or attachments) between these elements. These interfaces can be connector contacts, wire-wraps, thermal shunts, bonding layers between a printed circuit board and a heat sink, leads soldered into plated through holes (PTHs), chip solder attachments (flip-chip or C4), or surface mount (SM) solder joints.
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