Abstract

This abstract presents the development of a Silicon-on-Insulator (SOI) CMOS micro-electro-mechanical (MEMS) micro-hotplate based infra-red (IR) light source employing a vertically aligned multi-walled carbon nanotubes (VA- MWCNTs) emission layer. Chips were batch fabricated using a standard SOI CMOS process with tungsten metalization followed by a deep reactive ion etching (DRIE) post-CMOS process. VA-MWCNTs were grown at the chip level with a proven in-situ technique. The CNTs coated devices were compared with uncoated devices. Herein we discuss the device performance in terms of power dissipation, beam collimation, thermal transient times, integrated emitted radiation and emitted radiation spectral profile.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.