Abstract
An experimental study was presented to evaluate the microstructures and reliability of solder joints between Sn-2.5Ag-2.0Ni solder and various Ni plating layers. Ni(P)/Ni(B) and Ni(P)/Ni double layers were used to deposit on SiC(subscript p)/Al composites. The high reaction rate between Ni (B) layer and SnAgNi solder leaded to the highest growth rate of intermetallic compound (IMC) Ni3Sn4. The shear strength of solder joints with Ni (P)/Ni layer is higher than that of solder joints with Ni (P)/Ni(B) layer at the initial stage of aging, but lower than that after 250 h aging. Intermetallic layer growth and crack formation are the major reasons of failure for a SnAgNi/Ni/Ni (P) solder joint. While the failure of a SnAgNi/Ni (B)/Ni (P) solder joint is caused by the formation of holes between Ni (P) and SiC(subscript p)/Al composites, which result from directional diffusion of Ni toward solder.
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