Abstract
In this paper, the damage-coupled endochronic viscoplasticity was used in the cyclic uniaxial tensile test data of the Sn/3.8Ag/0.7Cu solder (equiaxed) at 298K and strain rate . The kernel functions ; and the strain rate sensitivity function were employed to construct the strain rate dependent steady cyclic stress - strain equations： . Except , the fatigue life of all strain rates are not significantly different. Using the endochronic fatigue life prediction formula in and , a straight line drawn in the vs. plot has slope C= 0.46. Due to rapid cooling rate of specimen’s preparation, the line to predict the fatigue life at , has the same slope, but the life is shorter. The uniaxial tensile fatigue data of the Sn/3.8Ag/0.7Cu solder under different temperatures (T = 298K ~ 393K). were used to determine the exponential function of . By proposing the degree of damage depends on positively N、T and , the T-modify power form damage equation and the T-modified Lee-Coffin-Manson (T-LCM) equation for life prediction: can be derived. From load-drop curves of all temperature, the critical damage factor , and the exponent of damage power form is a constant. Based on T=298K, fatigue life of all temperatures under vs. plot, two straight lines can be drawn in which slope C=0.46 at , and C=0.66 at . The T-LCM equation can predict the experimental data quite well.
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