Abstract
The interlayer reaction between Sn-3.0Ag-0.5Cu lead free solder and electrolytic coppers, those include different types of lattice defects analyzed by positron annihilation technique in advance, has been investigated. The copper sample, which has a higher concentration of vacancy clusters, has a higher growth rate of Cu3Sn layer formed on reaction diffusion with the solder, and only for the sample voids was observed in the layer.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
