Abstract
To improve solder-joint reliability, the Sn–3.0Ag–0.5Cu (SAC) solder had minor Ge and Pd additions to form composite solders. The results indicated that the Cu6Sn5 and Cu3Sn phases formed at the SAC–[Formula: see text]Ge/Cu interface ([Formula: see text], 0.5, 1.0, 2.0 wt.%) and the Ag3Sn phase precipitated in the solder. Cu6Sn5 and Cu3Sn phases formed at the interface and PdSn4 phase in the solder when the SAC–1.0Pd and SAC–2.0Pd reacted with the Cu. The SAC–1.0 Pd solder had the lowest liquidus temperature, and Ge addition improved the wettability.
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