Smart wound dressings based on carbon doped copper nanoparticles for selective bacterial detection and eradication for efficient wound healing application

Abstract

Bacterial infections are considered a major threat worldwide due to the fast emergence of antimicrobial resistance. Real-time monitoring and on time treatment of pathogens is a scientific as well as a practical challenge. The aim of the current research was the development of electrospun wound dressings with potent biocompatible, angiogenic, and antimicrobial action. Antibacterial electrospun polyurethane fibres containing carbon doped copper nanoparticles (C/Cu NPs) were fabricated by electrospinning method and characterized by microscopic and spectroscopic measurements such as scanning electron microscopy, Fourier Transform Infrared Spectroscopy (FTIR), X-ray diffraction analysis and contact angle measurements. Antibacterial activity of the C/Cu and C/Cu NPs containing polyurethane fibers was evaluated with bacterial strains Staphylococcus aureus and Escherichia coli and enhanced antibacterial activity was shown by C/Cu NPs and fibers containing C/Cu NPs. In vitro cell culture results clearly exhibited these nanoparticles would be helpful in proliferation and migration of fibroblast cells. Results of the wound healing study showed that PU/0.5% NP patches could effectively improve the healing of wounds. The angiogenic potential of the scaffolds was investigated by chorionic allantoic membrane (CAM) assay. Hence, the results obtained suggest that the fabricated nanofibers are the potential candidate to be used as antibacterial wound dressing for wound healing application.