Abstract

This paper describes a smart-pixel array technology that is being developed at Honeywell for use in chip-to-chip optical interconnections based on free-space optics. The technology combines large-scale, two-dimensional arrays of optoelectronic and microoptical elements with VLSI electronics to enable high-density, high-speed interchip input/output capability in the optical domain. We have demonstrated prototype modules with 16/spl times/16 and 32/spl times/32 emitter and interleaved detector arrays.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call