Abstract
AbstractA successful bottom‐up fill of single Damascene test features is achieved by using a two‐component additive package consisting of bis‐(sodium‐sulfopropyl)‐disulfide (SPS) and Imep polymers (polymerizates of imidazole and epichlorohydrin). In addition, a remarkable leveling effect is observed. Clearly, the Imep additive combines bottom‐up fill capabilities with leveling characteristics in one single polymer component. These unique hybrid properties of the Imep are rationalized on the basis of an extended N‐NDR (N‐shaped negative differential resistance) being present in the linear‐sweep voltammogram of the SPS/Imep additive system during Cu electrodeposition.
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