Smart fin with automatic evaporation and regeneration for thermal management of high heat flux electronics

Abstract

The high temperature of modern electronic devices poses great challenges to the safety and reliability of applications. Reasonable and effective control of device operating temperature for enhancing device performance and promoting the development of the electronics industry has a positive effect. Here, an innovative and efficient passive cooling technology is proposed to reduce the device temperature using polymerized metal fin and smart hydrogel to form smart fin. The smart fin carries away the waste heat generated by the device through evaporation and regeneration is accomplished by capturing water molecules from the environment. The smart fin is demonstrated to low down the temperature of a heater with heat flux of 2900 W/m2 by 48.3 °C and restores to its initial state after 160 min. At a threshold temperature of 60 °C, it promoted the maximum usage power by 49.4%. The evaporation and regeneration capacity of the smart fin can be controlled by ambient temperature, relative humidity, and smart hydrogel thickness. Specifically, high temperatures promote water evaporation and absorption, high humidity suppresses evaporation but favors absorption, and excessive thickness impedes water transport. This thermal management strategy with simple structure, low-cost, and easy-preparation is expected to become a universal technology in the electronics industry.