Abstract
Condition-based health management of electronic systems involves monitoring the system condition using real-time, in-situ sensing techniques and taking appropriate maintenance actions based on the physics-of-failure (PoF) interpretation of the collected data. This paper discusses the applicability of monitoring condition degradation in printed wiring assemblies (PWA) due to potential wearout failure mechanisms. Techniques are provided to assess the remaining life. © 1997 by John Wiley & Sons, Ltd.
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