Abstract
A small planar packaging (SPP) system is described that can be combined with card-on-board (COB) packaging in ATM switching systems with throughputs of over 40 Gbit/s. Using a newly developed quasicoaxial zero-insertion-force connector, point-to-point 311 Mbit/s of 8 bit parallel signal transmission is achieved in an arbitrary location on the SPP system's shelf. Also 5400 I/O connections in the region of the planar packaging system are made, and thus the SPP system eliminates the I/O pin count limitation. Furthermore, the heat flux of the SPP system is five times higher than that of conventional COB packaging because of its air flow control structure.
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