Abstract
The digital image analysis system (DIAS) is a software-oriented, computer-based approach to automatic image analysis. In this paper, some aspects of DIAS are discussed that can be performed with commercially available image pickup equipment attached to an optical microscope and linked to a sensor-based small computer (such as a System/7 or a Series/1). Through the application of an optical edge detection program, the system is adapted to precision measurement of linewidths and other parameters on semiconductor and garnet wafer patterns.
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