Abstract
A “field-shaping” cell was designed for electrodeposition on highly resistant ( e.g. thin film) substrates. The cell contained a partition with a slot that served as a virtual anode. Selecting the location of the partition as well as the location and the width of the slot, one can counteract the severe non-uniformity of the deposit caused by the ohmic potential drop along the highly resistant substrate. Formulae are derived for the primary current distribution in slot-type cells of various shapes, including cells with hoop-shaped slots. The theoretical calculations were verified in an experimental cell with a movable partition and a changeable slot size and were found to approximate accurately the actual current distribution. The use of slot-type cells and of the theory developed has enabled us to achieve a reasonably uniform electrodeposition on thin film substrates.
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