Abstract

We demonstrate horizontal slot waveguides using high-index layers of polycrystalline and single crystalline silicon separated by a 10 nm layer of silicon dioxide. We measure waveguide propagation loss of 7 dB/cm and a ring resonator intrinsic quality factor of 83,000. The electric field of the optical mode is strongly enhanced in the low-index oxide layer, which can be used to induce a strong modal gain when an active material is embedded in the slot. Both high-index layers are made of electrically conductive silicon which can efficiently transport charge to the slot region. The incorporation of conductive silicon materials with high-Q slot waveguide cavities is a key step for realizing electrical tunneling devices such as electrically pumped silicon-based light sources.

Highlights

  • The remaining critical capabilities yet to be demonstrated on the integrated silicon photonic platform using standard microelectronic fabrication processes are electrically pumped amplification and lasing within a silicon waveguide [1]

  • Pumped lasers have been demonstrated with IIIV materials evanescently coupled to a silicon waveguide [2, 3], these approaches rely on a wafer bonding step which is low throughput and not currently a standard microelectronic fabrication process

  • A guided optical mode with a polarization normal to the slot interface has a large electric field enhancement within the low-index slot region [9, 10] which supports an efficient conversion of material gain to modal gain [11]

Read more

Summary

Introduction

The remaining critical capabilities yet to be demonstrated on the integrated silicon photonic platform using standard microelectronic fabrication processes are electrically pumped amplification and lasing within a silicon waveguide [1]. It is advantageous to combine a silicon waveguide structure with a more efficient 1550 nm gain material for on-chip applications. Pumped lasers have been demonstrated with IIIV materials evanescently coupled to a silicon waveguide [2, 3], these approaches rely on a wafer bonding step which is low throughput and not currently a standard microelectronic fabrication process. In this paper we design, analyze, and experimentally demonstrate a novel silicon slot waveguide structure with geometry and materials suitable for electrical pumping of an active gain material

Methods
Results
Discussion
Conclusion
Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.