Abstract
Multi-wire saw machining (MWSM) used for slicing hard-brittle materials in the semiconductor and photovoltaic industries is an important and efficient material removal process that uses free abrasives. The cutting model of single-wire saw machining (SWSM) is the basis of MWSM. The material removal mechanism of SWSM is more easily understood than MWSM. A mathematical model (includes brittle fracture and plastic deformation) is presented in this paper for SWSM ceramic with abrasives. This paper determines the effect of various machining parameters on the removal of hard-brittle materials. For brittle fracture of SWSM ceramics, the minimum strain energy density is used as a fracture criterion. For plastic deformation of SWSM ceramics, the material removal is calculated using equations of motion. Actual wire-sawing experiments are conducted to verify the results of the developed mathematical model. The theoretical results agree with experimental data and practical experience. From the developed mathematical model, brittle fracture plays a major role in material removal of SWSM ceramics. Wire speed (S) and working load (P) are positively correlated with material removal of SWSM ceramics. The coefficient of friction is low, a lateral crack, which propagates almost parallel to the working surface, leads to more brittle fracture and material removal is increased.
Highlights
Ceramics are an important hard-brittle material for the semiconductor and photovoltaic industries.Wire-sawing technology is the most efficient and economic tool for machining hard-brittle materials, such as silicon, SiC, ceramic, and sapphire for the photovoltaic or semiconductor industries [1,2,3]
The efficiency of single-wire saw machining (SWSM) primarily depends on the cutting action of abrasive particles in the slurry
This paper developed a mathematical model for SWSM of brittle material manufacturing cost
Summary
Ceramics are an important hard-brittle material for the semiconductor and photovoltaic industries. Wang and Rajurkar [9] studied the cutting factors on the material removal rate (MRR) of an ultrasonic machining process. Slicing ceramics requires a high value for the MRR, but the processing conditions must be controlled to avoid instability, which causes defects such as cracks, porosity, and straying of the cutting path. The removal of the hard-brittle process13,using abrasive material during wire-sawing involves plastic deformation and brittle fracture. Rajurkar [9] studied the cutting factors on the material removal rate (MRR) of an ultrasonic machining driven abrasives move against than strike material. Onmaterial the other hand, someare studies developed aIn few material removal models for the wire-sawing process using abrasivemodel diamond particles [12,13,14,15].
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