Abstract

Thin film dimensions and microstructure affect the microscopic processes responsible for fatigue. This work focuses on the characterization of such mechanisms and the resulting fatigue behavior. The fatigue behavior of 0.2–1.5 μm thick, Ag films on SiO 2 was investigated. The films were tested using cantilever microbeam deflection with respect to the influence of loading conditions. Extrusions similar to those observed in bulk material were found at the Ag film surfaces after cyclic loading. Voids observed beneath the extrusions, close to the film-substrate interface, contributed significantly to fatigue failure. Fatigue damage was observed to occur predominantly in (100)-oriented grains. Thinner films were more fatigue resistant and contained fewer, smaller extrusions than thicker films.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.