Abstract
To understand for size effect on electromigration behavior in flip chip Pb-free solder bump, electromigration tests were performed with change of pad open size and solder bump height at 140degC, 4.6times10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sup> A/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> . Electromigration lifetime increases with pad open size and bump height decreasing. In pad open size change, electromigration lifetime increase with pad open size increasing because applied current decrease with pad open size decreasing. In bump height change, electromigration resistance increase with bump height decreasing due to thermal gradient induced thermomigration effect decreasing. It seems to that electromigration resistance increase with size of solder bump decreasing.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
