Abstract

Self-propagating exothermic reaction of Al/Ni multilayer film has been developed as a heat source with small heat region and high reaction rate in the field of bonding. In this paper, using this kind of localized and rapid heat source, solder preforms with different melting point such as SAC305 (217°C), Au80Sn20 (278°C) and A88Ge12 (356°C) have been applied to achieve the Si/Si bonding includes stacked Si bonding with the condition of 125°C preheating and 2MPa pressures, and the cross-sectional microstructure of bonding joints were observed. Subsequently, the shear tests of Si/Si bonding joints have been conducted and the results proved that the self-propagating exothermic reaction of Al/Ni multilayer is an efficient heat source to achieve the strong Si/Si bonding.

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