Abstract

films were deposited on /Si and Si substrates annealed at by rf magnetron sputtering. The oxygen gas flow rates were varied as 0, 40, and 80 sccm. Without post annealing process, thin films on /Si and Si substrates were polycrystalline with (100), (110), and (200) growth planes. The grain size of thin films was increased with increasing oxygen gas flow rate. The sheet resistance of thin films was decreased with oxygen flow rate due to the increased grain size which induced a reduction of grain boundary. TCR (temperature coefficient of resistance) values of thin films were obtained from -2.0% to -2.2%.

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